The invention discloses a thermoplastic polyamide composition containing 25-65 wt% of long-chain polyamide, 5-20 wt% of modified polyarylene ether resin and 30-65 wt% of D-glass fiber. The invention further discloses the preparation method of the thermoplastic polyamide composition and its application in high-frequency communication products. The thermoplastic polyamide composition exhibits outstanding dielectric properties and excellent mechanical properties, making it highly suitable for high-frequency communication technology applications.
Area Code: US
Application Number: CN201980039346.3
