The present invention discloses a high-step-resistant high-temperature release film and a manufacturing process thereof, belonging to the field of electronic products. The release film comprises three layers: a release layer, a high-elongation support layer and a release layer. The release layer is made of polymethylpentene-based material, and the high-elongation support layer is made of nylon-modified polyolefin-based material. The manufacturing process of the high-step-resistant high-temperature release film is also disclosed. The beneficial effects are as follows: the high-step-resistant high-temperature release film adopts a three-layer structure with a simpler configuration, and the layers form a uniform integral body without adhesive layers between the release layers and the core layer required in conventional five-layer structures. Production equipment is further simplified, and one-step production can be realized using a conventional casting machine with a simple and convenient process. The high-step-resistant high-temperature release film exhibits excellent lamination conformability and meets the pressing requirements of FPC customers, especially suitable for high-step pressing and filling of rigid-flex boards.
Area Code: CN
Application Number: CN201710550643.7
